Offsets and sensitivity at 25C were measured after devices were mounting on the PCB using a "flipper setup" (see figure below). The "flipper" is the robotic metallic PCB holder and can be rotated (flipped) in multiple directions. Since additional stress will apply to sensor after devices are soldering to PCB, offsets and sensitivities of devices may change from values measured during production test.
The DC offset of all output channels are measured at ambient only, and the distribution histograms are calculated from these measurements.
The flipper have the capability to rotate accelerometers and align one of its sensitive axis to gravity in both positive and negative directions. To minimize alignment error, the accelerometer sensitivity is calculated with its measurement at both positive and negative 1 g orientation. For example,
where X(+1g) and X(-1g) are sensor output with +/- 1g input.
After sensor sensitivities at each test temperature are measured, their values are typically plotted against oven or device temperature. The overall sensitivity change over entire temperature range should be calculated and reported. Any abnormal behavior such us sudden jump or significant shifts near hot or cold temperature set points should be investigated.
Sensitivity distribution at 25C is also derived from this test, from the entire sample size.
Number of devices of test: 96 from 3 lots
Power supply: Vdd=3.3V
Output sample rate: 100 Hz
Number of samples per measurement: 100
Temperature ramp rate: 1C/min
All offset vs. temperature curves are normalized to initial 25C readings.
Sensor Output Linearity Test
This test is to measure maximum linearity error of sensor output. Linearity error is calculated as the difference of a measurement point to the respective value of the best fit line.
The test conditions are:
Input Axes: X, Y, Z
Excitation level: 1 to 200 g
Frequency: 100 Hz
Device ODR: 3200
Number of devices under test: 15